Controlling Carboxyl Deprotonation on Cu(001) by Surface Sn Alloying

Alloying of Sn in the surface layer of Ag(111)

Structure And Surface Alloying of Sn on a Pt(110) Single Crystal

The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth

Tin (Sn) is a key industrial material in coatings on various components in the electronics industry. However, Sn is prone to the development of filament-like whiskers, which is the leading cause of many types of damage to electronics reported in the last several decades. Due to its properties, a tin-lead (Sn-Pb) alloy coating can mitigate Sn whisker growth. However, the demand for Pb-free surfa...

Surface alloying of immiscible metals induced by surface state shift

By using first principles calculations, it is found that the noble metal atoms Ag, Au and Cu would like to occupy the vacancy sites of the W(0 0 1) or Mo(0 0 1) surface to form the substitutional surface alloys, despite the fact that they do not like to form alloy in the bulk. The electronic local function (ELF) for these substitutional surface alloys shows that there is no obvious chemical bon...

Modifying the Cu(111) Shockley surface state by Au alloying

Z. M. Abd El-Fattah,1,2 M. Matena,2 M. Corso,2,3 M. Ormaza,4 J. E. Ortega,1,2,4 and F. Schiller1,2 1Centro de Fı́sica de Materiales (CSIC-UPV-EHU) and Materials Physics Center (MPC), E-20018 San Sebastián, Spain 2Donostia International Physics Center, Paseo Manuel Lardizábal 4, E-20018 Donostia–San Sebastián, Spain 3IKERBASQUE, Basque Foundation for Science, E-48011 Bilbao, Spain 4Departamento d...